中
Home
About GTBF
About GTBF
History
Organization
Management Board
Our Locations
CSR
Products
IPM-Series
TO-Series
SOP-Series
SOT-Series
QFN(DFN)- series
DSC-Series
Technology
Packaging
Testing
Simulation
IP
Quality
Recruiting
Compensation Benefits
Employee Activity
Training
Job Recruitment
Contact Us
Contact Information
Company Address
Photo Slbum
About GTBF
About GTBF
History
Organization
Management Board
Our Locations
CSR
Products
IPM-Series
TO-Series
SOP-Series
SOT-Series
QFN(DFN)- series
DSC-Series
Technology
Packaging
Testing
Simulation
IP
Quality
Recruiting
Compensation Benefits
Employee Activity
Training
Job Recruitment
Contact Us
Compensation Benefits
Employee Activity
Training
Job Recruitment
Photo Slbum
Core Technology
>
Core Technology
Core Technology
Packaging
Testing
Simulation
SOLUTION
1
Wafer Grinding
machine
DISCO
2
Wafer Saw
machine
DISCO
3
Die Attach
machine
ESEC / ASM / NEC
4
WireBond
machine
K&S, K&S / ESEC / SHINKAWA / ASM
5
Mold
machine
TOWA / BOSCHMAN / YAMADA/COBEST
6
Trim & Form
machine
FICO / COBEST
7
Test
machine
ASM / TESEC / AMIDA / SPANDNIX / EAGLE / ISMECA / SRM