Mold flow is one of the key factors in device packaging and has a significant impact on product reliability.

GTBF uses professional mold flow software for physical behavior analysis, which can predict filling behavior and filling lines.

The thermal factor is the biggest factor in the failure of semiconductor products. GTBF analyzes the thermal resistance characteristics and predicted junction temperature of products through professional thermal simulation services.At the same time provide customized analysis, combined with customer power conditions and use environment, estimate product heat distribution behavior, meet customer needs and specifications

GTBF uses professional simulation software to analyze the mechanical properties of the product under conditions such as process, reliability testing, and practical applications.

Effectively reduce process risk and reliability by calculating warpage, stress and reliability risks