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Packaging

>Core Technology

>Packaging

Die Bond

Epoxy

Solder

Paste

Wire

Wire Bond

Au

Cu

Al

ABC (Au Bond Cu)

Cu Clip

Al Ribbon

About GTBF Products Technology Quality Recruiting Contact Us

Customer Service Tel

(+86)-769-8691 5999 Ext.530

郵箱: Sales@gtbf-Ltd.com

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