SOP (Small Outline Package) have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using SMT (Surface Mount Technology) assembly, SOP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.
Introduction
Application
Cellular Phones
Wireless LAN
Digital Cameras
Video
Information Appliances
Feature
SOP lead counts available from 8 to 32
Existing BOM and process flow
JEDEC standard outlines
PRODUCT LIST
Image
NO.
Package
Lead
Body Size(mm)
Wire Capability
Data Sheet