TO (Transistor Outline) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts. The structures of TO packages vary widely, from expensive metal can enclosures to low-cost plastic-molded package bodies.
Introduction
Application
DC to DC converters
Low voltage motor controllers
Feature
Higher power handling capability
Extra heat sink support
Integrated circuits with low lead counts
PRODUCT LIST
Image
NO.
Package
Lead
Body Size(mm)
Wire Capability
Data Sheet