Recruitment Requirements
1. College degree or above, college English level 4 or above, oral and written communication is preferred.
2. Flexible thinking, good communication and coordination, strong resistance to stress
3. Office software operation skills

Work Content
1. Solve customer questions and complaints and maintain customers
2. Finishing audit 8D report
3. Translate English report
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Recruitment Requirements
1. Mechanical, physical, electrical, electronic...etc.
2. Familiar with ANNSYS and ICEPAK experience is especially good
3. AutoCAD, SolidWorks

Work Content
1. Responsible for material evaluation, material problem solving, polymer material verification experiment
2. Responsible for product process training, data collection and reporting, and practice verification methods
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Recruitment Requirements
1. Materials, Chemicals, etc.
2. Material physical characteristics analysis (DMA, DSC, TMA, Viscosity...) experience is better
3. Material chemical characteristics analysis (FTIR, AFM, ESCA, SEM...) experience is particularly good

Work Content
1. Responsible for material evaluation, material problem solving, polymer material verification experiment
2. Responsible for product process training, data collection and reporting, and practice verification methods
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Recruitment Requirements
1. Mechanical, physical, electrical, electronic ... materials, chemical ... and other backgrounds in science / Master / Die bond
2. Wire bond
3. Underfill dispense
4. Molding
5. Marking
6. Sawing / Singulation

Work Content
1. Responsible for the related technologies, methods, and materials research and development in the latter stage of packaging
2. Responsible for product process training, data collection and reporting, and practice verification methods
3. Excellent working experience in packaging factory
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Recruitment Requirements
1. Bachelor degree, three years experience in semiconductor packaging factory
2. At least one year of drawing design experience, mechanical design, metal materials, microelectronics technology
3. Skilled use of Auto CAD, UG, office software

Work Content
1. New product structure design
2. Lead frame design
3. New product evaluation
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